Imec researchers at IDLab, Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
At the European Conference on Optical Communication (ECOC) 2022, researchers from IDLab and Nokia Bell Labs presented the first upstream linear burst-mode transimpedance amplifier (TIA) chip that accommodates 50 Gbit/s NRZ and 100 Gbit/s PAM-4 modulation. The chip enables optical line terminals (OLTs) to cope with upstream packets’ varying signal strength and quality degradation; effects that are compounded by the very high speeds at which next-generation passive optical networks (PONs) operate. This novel TIA chip will be critical to making next-gen flexible PON deployments (and 100G PON networks in particular) technically and economically viable.
Read the full press release at imec
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